PART |
Description |
Maker |
HYS72T256322HP |
240-Pin Dual-Die Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYS72T1G042ER-5-B |
240-Pin Dual Die Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYS72T256322HP-3.7-A HYS72T256322HP-3S-A HYB18T1G4 |
240-Pin Dual-Die Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYB18T1G400BF |
240-Pin Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYS72T256000ER-3.7-B HYS72T256000ER-5-B HYS72T2560 |
240-Pin Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYS72T64301HP-3.7-A HYS72T64301HP-3S-A HYB18T25640 |
240-Pin Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYS72T64001HP |
240-Pin Registered DDR2 SDRAM Modules
|
Qimonda AG
|
HYS72T128020HR-3-A |
240-Pin Registered DDR2 SDRAM Modules 128M X 72 DDR DRAM MODULE, 0.45 ns, DMA240
|
Infineon Technologies AG
|
HYS72T256023 HYS72T512022HR-3.7-A |
240-Pin Registered DDR2 SDRAM Modules 512M X 72 DDR DRAM MODULE, 0.5 ns, DMA240
|
Qimonda AG
|
70287-1022 0702871022 |
2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 48 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
0702871220 70287-1220 |
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 52 Circuits, 6.10mm (.240) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective 2.54mm (.100") Pitch C-Grid垄莽 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 52 Circuits, 6.10mm (.240") Mating Pin Length, 0.76楼矛m (30楼矛") Gold (Au)
|
Molex Electronics Ltd.
|